A14569-03 Нархгузорӣ (доллари ИМА) [752дона саҳҳомӣ]
- 1 pcs$62.07266
- 3 pcs$61.76384
- Рақами Қисм:
- A14569-03
- Истеҳсолкунанда:
- Laird Technologies - Thermal Materials
- Тавсифи муфассал:
- THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5150 9" x 9"
- Manufacturer's standard lead time:
- Дар фурӯш
- Муҳлати нигоҳдорӣ:
- Як сол
- Chip Аз:
- Гонконг
- RoHS:
- Намуди пардохт:
-
- Тарзи интиқол:
- Категорияҳои оила:
- KEY Component Co., LTD як дистрибютор оид ба қисматҳои электронӣ мебошад, ки категорияҳои маҳсулотро пешниҳод мекунад, аз ҷумла: Гармӣ - adhesives, epoxies, greises, pastes, Гармӣ - Гармӣ, Гармӣ - Маҷмӯаҳои термоэлектрикӣ, Пелтиер, Гармӣ - Плазаҳо, лавҳаҳо, Фанҳои DC, Гармӣ - сардшавии моеъ, Гармӣ - Лавозимот and Мухлисони AC ...
- Афзалияти рақобатӣ:
- We specialize in Laird Technologies - Thermal Materials A14569-03 electronic components. A14569-03 can be shipped within 24 hours after order. If you have any demands for A14569-03, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A14569-03 Аттрибутҳои маҳсулот
Рақами Қисм :
A14569-03
Истеҳсолкунанда :
Laird Technologies - Thermal Materials
Тавсифи :
THERM PAD 228.6MMX228.6MM BLUE
Серияхо :
Tflex™ 500
Статуси Қисми :
Not For New Designs
Истифода :
-
Намуди :
Gap Filler Pad, Sheet
Шакл :
Square
Натиҷа :
228.60mm x 228.60mm
Ғафсӣ :
0.150" (3.81mm)
Маводи :
Silicone Elastomer
Илова :
Tacky - Both Sides
Бозгашт, Интиқолдиҳанда :
-
Ранг :
Blue
Муқовимати гармӣ :
-
Гузариши гармӣ :
2.8 W/m-K
Охирин хабарҳо
Шояд шумо низ таваҷҷӯҳ зоҳир карда метавонед
-
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-126
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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CD-02-05-220-N
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-22
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
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